Halogen-Free and Head-in-Pillow
One of the primary concerns with halogen-free solder pastes and fluxes revolves around the wetting and coalescence. The reason that halogens (usually ...
Solder Paste
False Economy
Folks, I recently met a colleague and the following discussion ensued: Dr. Ron (DR): How are things? Colleague©: Kinda discouraging at my......
Transfer Efficiency of Ball Attach Fluxes
This is a chart of flux transferred in a ball attach process over a 3 day span. ......
Low Residue Flip Chip Solder Paste
Low residue flux for flip chip attachment has many advantages (please see Ultra Low Res Flip Chip Flux) over standard no-clean and water soluble fluxe...
Universal Technology Update; Is your process biased?
At what point in new product development does the solder get updated with the rest of......
Fine Feature Assembly Issues vis a vis Lead-Free
Folks, We are all aware that the miniaturization of electronics continues unabated. As consumers we benefit from this phenomenon, as electronic assemb...
BGA Red Dye Penetrant Testing
Ok, so it happened again. Another urgent request was brought to me for action. This time it was a customer who had performed a Red Dye Penetration......
Engineered Solders with a European Flavour
Alan Fairbairn Guest Blogger European Business Development Manager Engineered Solders Materials I hope I can bring a European flavour to Engine...
Package-on-Package Process; an interview with Jim Hisert
Package-on-Package (PoP) use in the SMT process is slowly creeping from a niche application into mainstream use. From experience, I know that s...
Head-in-Pillow Defects 4: Material Issues
Head-in-pillow defects related to solder paste or flux performance are classified as Materials Issues. These include poor transfer efficiency on stand...
Head-in-Pillow Defects 3: Process Issues
Head-in-pillow defects caused by on-line processing issues are categorized under Process Issues. These include printing, placement and reflow. Printin...