Package-on-Package Reflow (5/5)
Okay, you’re at the final stage of Package-on-Package assembly. Simply heat per the reflow profile suggested by your solder manufacturer (hopefu...
Solder Paste
Transfer Efficiency 1: Solder Paste Height versus Component Pitch
A great Indium Knowledge Base question came from a customer last week for “recommendations on solder paste height versus component pitch…&...
Package-on-Package Transport (4/5)
Keep in mind that the stack of components that have just been assembled are vulnerable to misalignment and oxidation. We have done some work up-front ...
Package-on-Package Placement (3/5)
Stacking Package-on-Package components is one of the easiest parts of the assembly process. Although each Package-on-Package solder paste and Package-...
Package-on-Package Component Dipping (2/5)
Before even thinking of dipping a component, you had better verify that your paste or flux is 1) the proper thickness and 2) uniform across the surfac...
A Method to Attach Indium Interfaces over Large Surface Areas
In a past entry, I discussed the characteristic formation of surface oxides on indium and the various methods by which to remove these to achieve a so...
Do LEDs need pure metal thermal interface materials?
Simply stated, YES. In effort to stay on top of industry technology I spend as much time as I can afford attempting to learn about the current thermal...
Solder Paste Squeegee Hang-Up
I just returned from a business trip and encountered a common problem, solder paste squeegee hang up. But like nearly all of the cases I’ve seen...
Package-on-Package Paste Leveling (1/5)
This is the first of a series of entries dealing with tips for Package-on-Package assembly. A logical place to begin is material deposition. It is imp...
Halide Free Flux Interest Continues
Folks, My colleagues at Indium Corp tell me that some major companies are now starting to specify maximum halogen levels in solder paste flux residues...
Au/Sn - One of a Kind
For those of us who recommend solder alloys, Au/Sn holds a place in our hearts. In many cases it is the #1 solder for an application (if......
Control Your Materials, or They Will Control You (part 2)
Optimizing the amount of solder paste transferred during component dipping for Package-on-Package assembly should be a goal for your PoP process. Whil...