Avoid the Void® Under QFN Components with Solder Fortification
Using Solder Fortification preforms to increase solder volume can significantly reduce voiding in QFN components...
Using Solder Fortification preforms to increase solder volume can significantly reduce voiding in QFN components...
Produce robust RF Shield connections using solder fortification solder preforms....
Apply Solder Fortification preforms to strengthen solder joints and improve reliability....
This is the last in a series of blog posts that discusses reinforced Solder Preforms for high–reliability and low voiding. Today's focus is ...
This is the fourth in a series of posts that talks about reinforced Solder Preforms for high–reliability and low voiding. Today's focus is v...
This is the third in a series of blog posts that talks about reinforced Solder Preforms for high–reliability and low voiding. Quantifiable bondl...
This is the second in a series of blog posts discussing reinforced solder preforms for high–reliability and low voiding....
InFORMS® can help you reduce voiding, improve reliability, and enhance solder performance in high-power applications....
Indium Corporation is presenting 3 papers at the SMTA PanPac in February. Learn more....
Soldering IGBTs: Focus on the direct-bond copper substrate level of the stack-up....
A preform is a piece of solder (available in a wide variety of shapes)....
Watch as I discuss the challenge of voiding in bottom-terminated components - and how to Avoid the Void®....