Using Solder Fortification® in Through-Hole Component Applications
Using Solder Fortification® to improve solder joint reliability in through-hole component applications...
Solder Preforms
Soldering 80Au/20Sn with Specialized Fluxes & Formic Acid
Not all fluxes can handle the high processing temperature required for Au/Sn solder preforms....
Avoid the Void® Under QFN Components with Solder Fortification
Using Solder Fortification preforms to increase solder volume can significantly reduce voiding in QFN components...
Fortify Your RF Shield Connections, One Solder Fortification Preform at a Time
Produce robust RF Shield connections using solder fortification solder preforms....
Create Healthier & Stronger…Solder Joints
Apply Solder Fortification preforms to strengthen solder joints and improve reliability....
Reinforced Solder Preforms for High-Reliability and Low Voiding | Voiding Results
This is the last in a series of blog posts that discusses reinforced Solder Preforms for high–reliability and low voiding. Today's focus is ...
Reinforced Solder Preforms for High-Reliability and Low Voiding | Voiding DOE
This is the fourth in a series of posts that talks about reinforced Solder Preforms for high–reliability and low voiding. Today's focus is v...
Reinforced Solder Preforms for High-Reliability and Low Voiding | Quantifiable Bondline Consistency
This is the third in a series of blog posts that talks about reinforced Solder Preforms for high–reliability and low voiding. Quantifiable bondl...
Reinforced Solder Preforms for High-Reliability and Low Voiding | Technology Advancement
This is the second in a series of blog posts discussing reinforced solder preforms for high–reliability and low voiding....
Introduction Natural Limitations of Solder Joint Performance in High-Power Applications
InFORMS® can help you reduce voiding, improve reliability, and enhance solder performance in high-power applications....
PanPac is a great opportunity to learn more about new technologies!
Indium Corporation is presenting 3 papers at the SMTA PanPac in February. Learn more....
Solder Redefined : The InFORM® for IGBT Assembly
Soldering IGBTs: Focus on the direct-bond copper substrate level of the stack-up....