The Limits of Mixing: A Chocolate Chip Example
Folks, We tend to think of mixing as something that can completely even out those things being mixed. As an example, let’s assume you are ...
Solderability
An Alternative Approach to Sputtering Target Bonding
A traditionally bonded sputtering target experiences a wide range of temperatures over its life cycle. It is bonded at over 200°C – usually ...
The Perfect Sputtering Target Bond
Why do we care so much about target bonding? This is important because a sputtering target that truly performs will allow greater process flexibility,...
NanoBond® is a Fluxless Process
Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux...
High Temperature (Braze Alloy) Sputtering Target Bonding, with NanoFoil®
In an earlier post I mentioned one of the presentations we gave at the 2013 SVC TechCon. The other presentation that our team delivered at t...
Thermal Cycling Performance of SACm® Pb-Free Solder Alloy
The development of SACm® lead-free solder alloy by Indium Corporation’s R&D team was focused around improving the mechanical shock perfo...
NanoFoil® Tools of the Trade
As an application engineer working with various NanoFoil® applications, I have learned which common items are very handy to have with me whenever...
NanoFoil® for CPV Attachment
The attachment of concentrated photovoltaic (CPV) cells is the perfect application for NanoFoil®. Due to the isolated heating during bonding, less...
Coefficient of Thermal Expansion
When dealing with bonding, we often mention CTE (Coefficient of Thermal Expansion). This is a very important topic when designing a soldered interface...
Measuring Void Content and Further Global Warming Musings
Folks, A reader writes: Dear Dr. Ron, I need to measure the void content of an alloy. Is there an easy way to do it? After a little thoug...
Drop Test Performance of SACm® Pb-Free Solder Alloy
As I discussed in my last post, the industry has found that reducing the silver content of SAC alloys helps to improve its mechanical shock performanc...
Leadframe Solderability Issues in Power Semiconductors
It is no secret that automotive semiconductor customers are becoming increasingly demanding. The “under the hood / bonnet” electronics env...