Manufacturing Indium with Pride
I recently caught up with Brent Boek, Supervisor of the indium cell at our Utica Business Park manufacturing facility in New York. Brent and his crew ...
Solderability
NanoFoil® for LED Manufacture
NanoFoil® is especially well-suited for bonding LED packages. Here are some characteristics of the NanoBond® Process that fit high v...
"Per Homogeneous Material" Also Applies to Medical Devices Under RoHS
Folks, It’s been awhile, let’s see what Patty is up to… Patty was in her office, finishing lunch and reading Golf Digest. She...
A Simple NanoFoil® Demonstration
Here is a straightforward demonstration of NanoFoil® activation. NanoFoil is a heat source that is used to bond / solder electronics compone...
NanoFoil® Project Management with Seth Homer
In an interview with Seth Homer (our Asst. Product Manager for Engineered Solders and NanoFoil®), we discuss how an interested customer can partne...
A Bond Tester That Can Grow With Your Company
It’s been a while since I have mentioned equipment on this blog, so I began by searching for updates to equipment I already know and enjoy. It...
Pros & Cons of Bending or Folding Bus Ribbon in Solar Panel Fabrication
As bus ribbon makes its way around the corners of a solar panel, it must divert current at right angles. These 90° ribbons are produced from a sin...
NanoBond® is a Room Temperature Bonding Process
As I mentioned in an earlier post, some soldering applications require a fluxless process. In this line of work you see an assortment of odd soldering...
NanoFoil®: Protecting electronic components everywhere!
We have all seen the action movies where the hero drops in at the last minute to save the day against insurmountable odds. NanoFoil® is like...
Great First Pass Yield and Productivity, but Poor Profit?
Folks, Let’s see what is up with Patty…..... Patty sat at her computer, admittedly a little tired. She had just gotten back after a...
A Variable Zero Stress Point
We have observed that the temperature at which two materials are bonded will set the base temperature that any subsequent CTE is measured from. T...
Reflow of Copper Pillar Microbumps
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...