Stencil Printing for SMT Assembly Success Part 2: Print Metrics
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “...
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “...
Let’s talk viscosity. Most of us are experienced with paint. Paint is a thick liquid that is applied to a surface and then, for the most p...
SMT Optimization for Success in Printing Ultrafine Solder Paste Deposits The SMT industry widely accepts that ~60% of solder defects occur at the ste...
Folks, It is hard to imagine, but it has been just a little short of 13 years ago that Jim Hall, Phil Zarrow and I approached SMTA’s JoAnn Strom...
Most SMT fluxes and solder pastes are either classified as RO or OR. Every once in a while one will see an occasional RE flux. People typically recogn...
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex...
Folks, Pity the solder scientists of the late 1970s and early 1980s. SMT was an emerging technology and the world wanted to buy solder paste.&nb...
Folks, Some years ago, a leading IC manufacturer decided that their R&D effort could benefit if analyzed for possible improvement – by hirin...
Indium metal powder is mixed with flux for application by dispensing or printing equipment. This mixture is referred to as solder paste. Lucky fo...
Ronnie Spraker is the supervisor of our NanoFoil® production department. Everyday, Ronnie and his team make reactive foils that are used all over ...
Spheres are the form of indium I use the most for testing solder wetting properties, because they have a precise volume. (As opposed to shot, which do...