Tech Spotlight: Maria Durham
While not directly part of Indium Corporation’s Technical Service department, Maria is technology driven and works with our customers to help se...
Soldering Materials
IMAPS 2013: International Symposium on Microelectronics
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending b...
Tech Spotlight: Derrick Herron
Today we focus on Derrick Herron – one of the newest members of Indium Corporation’s Technical Services team. While new to tech servi...
Important Classes for Understanding Solder
Solder seems pretty simple, and, honestly, it doesn’t always need to be overly technical. But, many SMT, semiconductor, thermal management, and ...
RoHS Medical "Per Homogeneous" Conclusion
Folks, Let’s see how Patty and Pete are doing with their Medical Device RoHS Crisis….. Patty and Pete sat in a plane on the runway of the...
Panning for Gold
Panning for gold is a thrill, just like scratching off a lotto ticket or playing a game at a casino. In a similar way, I am looking for gold every tim...
"Per Homogeneous Material" Also Applies to Medical Devices Under RoHS
Folks, It’s been awhile, let’s see what Patty is up to… Patty was in her office, finishing lunch and reading Golf Digest. She...
NanoFoil® Project Management with Seth Homer
In an interview with Seth Homer (our Asst. Product Manager for Engineered Solders and NanoFoil®), we discuss how an interested customer can partne...
NanoFoil®: Protecting electronic components everywhere!
We have all seen the action movies where the hero drops in at the last minute to save the day against insurmountable odds. NanoFoil® is like...
A Variable Zero Stress Point
We have observed that the temperature at which two materials are bonded will set the base temperature that any subsequent CTE is measured from. T...
Reflow of Copper Pillar Microbumps
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...
An Alternative Approach to Sputtering Target Bonding
A traditionally bonded sputtering target experiences a wide range of temperatures over its life cycle. It is bonded at over 200°C – usually ...