Solderless Technology Meeting at APEX
Folks, APEX 2010 appeared to be a great success. Attendance was high and my “Lead-Free Assembly” workshop broke a personal record of ...
So what is solder anyway?
After spending a couple of days at some Indium Corporation NanoFoil® customers, I am back in front of my computer working on customer trip reports...
Lack of Data to Support "Tin Whiskers' Being Major Reliability Concern for Toyota
Folks, Bob Landman’s comments to my tin whisker posts appear below. Friendly dialogue such as this helps us to all learn more and is ...
NanoFoil®: Low-Void Solder Bonding Under Pressure
So, I figured while I’m at 30,000 feet in an airplane on free wi-fi (how long have we waited for this? Thank you AirTran®!), it would be a p...
Thermal Management with Indium-Indium 101
Indium metal has grown into its starring role in recent years as an excellent thermal management / thermal interface material. While the thermal...
Are Solder-Related Tin Whiskers Implicated in Toyota Sudden Acceleration Issues?
Folks, After my recent post on the fact that there was no data linking tin whiskers to the Toyota sudden acceleration issues, there continue to be m...
Low Temperature Alloys - Soldering 101
The most common melting temperature range for standard solders (like SnPb or SnPbAg) is in the 180°C to 190°C range, and the mo...
Unmistakable Bar Solder
I work for a company that manufactures solder, so I have a pretty keen eye for it. Even so, it’s still hard to tell......
NanoFoil(r) Basics: Activation Part II
In my last post, NanoFoil Basics: Activation Part I, I talked about NanoFoil® activation properties (remember, I’m not using the t...
Solder Reflow Profiling Tips - Graping
Graping is a phenomenon which appears as un-reflowed solder particles, typically seen on the surface of the solder joint. &nbs...