Theory of “Ball Drop” Sphere Placement
After transferring flux, align the stencil Setup print parameters to minimize doubles and......
After transferring flux, align the stencil Setup print parameters to minimize doubles and......
Folks I was chatting recently with Indium Corporation’s Mike Fenner about Sn/Cu alloys for solder paste. Mike has many years of experience ...
The Insulated Gate Bipolar Transistor (IGBT) module is rapidly taking over from MOSFET technology as the solid-state power switch of choice. Die-attac...
A few of Indium’s solder experts ready to assist. I am well aware that many of you are now working in stressed out, short-handed workplaces and ...
Don’t’ expect a simple answer – that depends on your application. span......
Photo courtesy Optocap Au stud bumped flip chip attachment? Low temperature assembly requirements? Indium is your answer…br......
The folks at Advanced Packaging magazine asked Indium Corporation for its predictions for the Standard Semiconductor and Power Semiconductor packaging...
Diagram of Solder-Dipping Test Apparatus Solder-wetting Curve ......
Paste deposits printed for a QFN footprint In an article from Circuits Assembly......
I can’t promise that every gold-indium or copper-indium soldering process can work without a flux, but there are tricks to give you a better cha...
Indium Corporation is a big proponant of using the EN14582 oxygen bomb test method for halogen determination. However, we have seen misleading r...