150-Year Anniversary of the Thayer School of Engineering at Dartmouth
Gain a little insight into the prestigious Thayer School of Engineering at Dartmouth....
Videos
Process Considerations for QFN Voiding in SMT Electronics Assembly (1/3)
This is part one of a three-part series. This video is for anyone interested in design of experiment aspect of Avoid the Void®......
Process Considerations for QFN Voiding in SMT Electronics Assembly (2/3)
This is part two of a three-part series. This video is for anyone interested in the design of experiment aspect of Avoid the Void®......
Process Considerations for QFN Voiding in SMT Electronics Assembly (3/3)
This is part three of a three-part series. This video is for anyone interested in Design of Experiment aspect of Avoid the Void®......
The Versatile Solder Preform (VIDEO)
A preform is a piece of solder (available in a wide variety of shapes)....
Achieving 8% Voiding When Soldering Bottom-Terminated Components (VIDEO)
A paper presented at SMTAI 2016 on reducing voids in bottom-terminated components......
SiP Materials (System-in-Package) VIDEO
There exists a wide range of assembly products for the SiP process, especially solder pastes....
Ball-Attach Flux: WS-575-C-RT (VIDEO)
Currently, for the ball-attach process, customers are facing issues like warpage of the substrates......
Avoid the Void® Common Causes of Voiding in Electronics Assembly
This video is for anyone interested in the causes and effects of voiding in solder paste. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, voidin...
Introduction to Head-in-Pillow and Non-Wet Open Defects In Electronics Assembly
This video is for anyone interested in mitigating head-in-pillow and non-wet open defects. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, head-...
In-Circuit Testing with Fast-Break Residue No-Clean Solder Paste
This video is for those interested in In-Circuit Test (ICT) with no-clean solder paste. Keywords: Phil Zarrow, Glen Thomas, askus@indium.com, In-Circu...