Intermetallics In Soldering
Intermetallics are a necessary evil in the metal-to-metal bonding world, which definitely includes soldering. There are two basic ways that metal will...
Voiding
Solving the QFN Voiding Problem With Solder Preforms
Folks, Rob heads to Guadalajara to solve the QFN voiding problem...... As Rob sat on the airplane, he was excited to go to GDL (Guadalajara, Mexi...
Things I Learned at IWLPC 2010
Once again, here are some things I learned at this year’s IWLPC show 2010 in Santa Clara. Picture below taken at Philadelphia airport,...
Understanding Thermal Resistance Calculations
I have previously discussed various reasons why thermal considerations in a device cannot be an afterthought. There are various methods for handl...
NanoFoil(r) Basics: Activation Part II
In my last post, NanoFoil Basics: Activation Part I, I talked about NanoFoil® activation properties (remember, I’m not using the t...
INTERVIEW: Klaus Roehmer: PINK Vacuum Reflow
Figure 1: 15% Voiding with air reflow Figure 2: ~0% Voiding after vacuum reflow ......
Mentos, Diet Coke, and Mixed Alloy Voiding
Most of you have probably seen videos of countless Mentos/Diet Coke experiments all over the internet. If you are one of the few who have not, t...
Heard the one about....?
“Hey, Andy!!” The stranger grinned. “Nice to meet you in the flesh at last!”. It was the last customer visit on a recent trip ...
Virtual Reality? The Virtual-PCB Online Tradeshow
For my next trick, I will be participating in a chat session as part of the Virtual PCB Show on February 25th from 11:00AM to 11:45 AM.......
Surface Finishes 3: Soldering to Immersion Silver (ImAg)
Next on the soldering to list is soldering to immersion silver (ImAg). ImAg is probably the only solder finish that is sensitive to the profile used f...