To Minimize BTC Voiding, Start with the Right Solder Paste
Let’s see what’s up with Patty….. Patty was just dropped off at O’Hare airport after finishing a 3 day workshop on Lean Six S...
Voiding
Voiding: A Critical Issue in Electronics Assembly
QFN voiding is a significant electronics issue today. Patty & her team tackle voiding in QFNs, BTCs (bottom-terminated components), and more....
Materials Lifetimes - A Modest Proposal
Specific and consistent terminologies are required to enable accurate and effective discussions of soldering materials....
Flux-Coated Solder Preforms
Flux-coated preforms allow you to reduce the amount of flux that’s presented to the joint and increase the solder volume. SMT expert Phil ...
Using and Specifying Solder Preforms
Why use solder preforms? SMT industry expert Phil Zarrrow finds out from Jim Hisert, Indium Corporation Manufacturing Engineer. ...
Voiding in the Thermal Ground Pad of BTC Components
Phil Zarrow interviewed Derrick Herron, a technical support at The Indium Corporation. PZ: With the advent of bottom-terminating components, one of...
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II
As we discussed in part I of this three-part series, uneven solder bondline thickness between the substrate and baseplate of an IGBT module can cause ...
SMTA International 2015, One Month Away!!!
SMTA International 2015 is just around the corner. If you want to see what our engineers will be presenting at the show check out this blog; there is ...
Applying Solder Preforms – Heating (with Guest Star Brandon Judd)
For this week’s World of Solder Preforms series installment, Brandon Judd explains the importance of reflow profiling: Solder preforms are a ver...
Two NEW products featured at SMTAI 2014
As with many companies exhibiting at SMTAI, Indium Corporation is featuring several new products that address many of the concerns of our custo...