Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will present at APEC 2018, March 4-8 in San Antonio, Texas.
Dr. Mackie will present Joining Materials’ Reliability for Evolving Power Applications. This presentation will discuss the impact of form, application, and regulatory considerations on materials design criteria. It will also demonstrate how one materials supplier is meeting the plethora of customer needs for analog and power device manufacturability and reliability.
Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has more than 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Dr. Mackie has a doctorate in physical chemistry from the University of Nottingham, U.K., and a Master of Science in Colloid and Interface Science from the University of Bristol, U.K. He is also formally trained in Six Sigma – Design of Experiments.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
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