Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will present at APEC 2018, March 4-8 in San Antonio, Texas.
Dr. Mackie will present Joining Materials’ Reliability for Evolving Power Applications. This presentation will discuss the impact of form, application, and regulatory considerations on materials design criteria. It will also demonstrate how one materials supplier is meeting the plethora of customer needs for analog and power device manufacturability and reliability.
Mackie 博士是物理化学、表面化学、流变学以及半导体组装材料和工艺方面的电子行业专家。他在新产品和新工艺开发以及从晶圆制造到半导体封装和电子组装等所有电子制造领域的材料营销方面拥有 20 多年的经验。Mackie 博士拥有英国诺丁汉大学物理化学博士学位和英国布里斯托尔大学胶体与界面科学理学硕士学位。
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
