Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at IPC APEX EXPO 2019, Jan. 29-31, in San Diego, California, USA.
Electrical reliability is a must-have for electronic components and products to work properly, especially when issues like ionic contamination under low stand-off components can cause dendritic growth which can lead to intermittent operation or short-circuiting and ultimately field failures.
Indium8.9HF is an air reflow, no-clean solder paste specially formulated to enhance electrical reliability and eliminate dendritic growth in high power products, such as automotive electronics manufacturing.
Indium8.9HF delivers peace-of-mind, knowing that assemblies will maintain integrity with:
- Increased electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth
- Improved thermal reliability due to its low-voiding performance on bottom terminating components (BTCs), reducing the risk of application or product failure
Indium8.9HF can accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.
For more information about Indium8.9HF Solder Paste, visit indiumstg.wpenginepowered.com/avoidthevoid or stop by booth #3133 at the show.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
