As a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
With 10 years of expertise in EV manufacturing and more than 10 million electric vehicles using its advanced materials, Indium Corporation will showcase its Rel-ion™ product suite. These products offer reliable electrical, mechanical, and thermal solutions designed to accelerate manufacturers’ time to market. Rel-ion™ material solutions enhance reliability by:
- ノン・ウェット・オープンとヘッド・イン・ピローの欠陥の排除
- より厳しい表面絶縁抵抗要件を満たすことで、樹枝状突起の成長を防ぐ
- 正確なボンドライン制御と耐クリープ性・耐疲労性の向上により、はんだ剥離を防止
- 熱効率の向上により、ホットスポットに起因するボイドの発生を抑制
Indium Corporation will focus on the following featured products:
- Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and it even outperforms SAC305 with optimal process setup.
- Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
In addition, Indium Corporation will showcase the following products of high-reliability materials powering sustainability:
- Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
- InTACK® is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
- Durafuse® HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
- Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program.
- InFORCE® is a series of high-reliability pressure sinter pastes, offering copper and silver formulations with excellent thermal conductivity. Optimized for printing, large-area sintering, and low-temperature processing, they offer innovative solutions for advanced die-attach and package applications.
To learn why Indium Corporation is trusted by top EV manufacturers across the globe, visit the company’s experts at booth N4.4102 or at indiumstg.wpenginepowered.com
About Indium Corporation
インジウム・コーポレーション®は、世界のエレクトロニクス、半導体、薄膜、および熱管理市場向けに、素材の精製、製錬、製造、供給を行うトップクラスの企業です。 製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズなどの金属および無機化合物、ならびにNanoFoil®が含まれます。1934年に設立された同社は、世界的な技術サポート体制を整備しており、中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を構えています。
インジウム・コーポレーションに関する詳細については、indiumstg.wpenginepowered.comをご覧いただくか、[email protected] までメールでお問い合わせください。また、当社の専門家による「From One Engineer ToAnother®（#FOETA）」をwww.linkedin.com/company/indium-corporation/ でフォローすることもできます。
