任何從事 BGA 焊點可靠性工作的人都應該習慣 X 射線檢測，Si-Li 和 Ge-Li 以及 Cd-Te 和 Cd-Zn-Te。這些材料能感應 X 射線，並將其轉換成電子信號。 X 射線設備非常適合用於分類 BGA 焊點、某些熱介面、電源晶片連接以及一系列不同的焊接相關應用中的空隙。
如果您想分享您的 X 光故事，請發送至[email protected]。 可在部落格上分享須公開的故事。
Robotic soldering has evolved from a productivity upgrade into a precision requirement—especially as electronics become smaller, denser, and require shorter production cycles. In Part 1 of this
Silver prices are escalating rapidly, consistently trending upward. If you manage a bill of materials (BOM) for electronics manufacturing, you understand precisely how this volatility impacts your
Manufacturing modern electronics often feels like a balancing act—literally. Assembly tilt and uneven coplanarity are persistent headaches that compromise solder joints, leading to weak connections
