任何从事 BGA 焊点可靠性工作的人都应该熟悉 X 射线检测，Si-Li、Ge-Li 以及 Cd-Te 和 Cd-Zn-Te 使 X 射线检测成为可能。这些材料能感应 X 射线并将其转换为电信号。 X 射线设备非常适合对 BGA 焊点中的空隙、某些热界面、电源芯片附件以及一系列不同的焊接相关应用进行分类。
如果您想分享您的 X 光故事，请发送至[email protected]。 可在博客上分享不公开的故事。
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