Indium Corporation will show customers how to Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at CEIA Xiamen on November 7 in Xiamen, China.
Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process conditions, this solder paste series:
- 超越所有增強電氣可靠性和 SIR 性能的要求
- Delivers excellent response-to-pause, even after being left on the stencil for 60 hours
- 在室溫下放置一個月後，仍可維持優異的印刷與回流焊效能
- Demonstrates consistent printing performance for up to 12 months when refrigerated
- 防止助焊劑過早擴散，防止表面氧化
- 適用於含 Pb 和不含 Pb 的合金
- 符合 HKMC MS184-01 B 類測試標準 - 汽車業最嚴格的可靠性標準之一
The Indium8.9HF series provides a unique oxidation barrier technology that eliminates HIP defects and graping, making these solder pastes perfectly suited for automotive and electronics assembly applications.
For information on how Indium8.9HF can help you Avoid the Void®, visit Indium Corporation at the show or www.indium.com/avoidthevoid.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
