Indium Corporation’s Andy C. Mackie, PhD, MSc, senior product manager for semiconductor and advanced assembly materials, will share his expertise at the International Microelectronics Assembly and Packaging Society (IMAPS) San Diego chapter meeting on Oct. 28 in San Diego, Calif.
From standard chip-attach to power devices using flip-chip on leadframe, copper-pillar/solder micro bump is emerging as a standard flip-chip solder bump replacement. Dr. Mackie’s presentation, Ultra-Low Residue Semiconductor Fluxes Enabling Embedded and Low Form Factor Flip-Chip Assembly, addresses this trend. It includes data that shows design and critical-to-functionality criteria that are driving the adoption of ultra-low residue flux in large-scale customer production using dipping applications.
Mackie 博士是物理化學、表面化學、流變學以及半導體組裝材料和製程方面的電子產業專家。他在從晶圓製造到半導體封裝和電子組裝等所有電子製造領域的新產品和製程開發以及材料行銷方面擁有超過 20 年的經驗。Mackie 博士擁有英國諾丁漢大學 (University of Nottingham) 物理化學博士學位，以及英國布里斯托爾大學 (University of Bristol) 膠體與介面科學理學碩士學位 (MSc)。此外，他也接受過六標準差 - 實驗設計的正式訓練。
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses, and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需有關 Indium Corporation 的更多資訊，請造訪www.indium.com或發送電子郵件至 [email protected]。
