Indium Corporation’s Andy C. Mackie, PhD, MSc, senior product manager for semiconductor and advanced assembly materials, will share his expertise at the International Microelectronics Assembly and Packaging Society (IMAPS) San Diego chapter meeting on Oct. 28 in San Diego, Calif.
From standard chip-attach to power devices using flip-chip on leadframe, copper-pillar/solder micro bump is emerging as a standard flip-chip solder bump replacement. Dr. Mackie’s presentation, Ultra-Low Residue Semiconductor Fluxes Enabling Embedded and Low Form Factor Flip-Chip Assembly, addresses this trend. It includes data that shows design and critical-to-functionality criteria that are driving the adoption of ultra-low residue flux in large-scale customer production using dipping applications.
Mackie 博士是物理化学、表面化学、流变学以及半导体组装材料和工艺方面的电子行业专家。他在新产品和新工艺开发以及从晶圆制造到半导体封装和电子组装等所有电子制造领域的材料营销方面拥有 20 多年的经验。Mackie 博士拥有英国诺丁汉大学物理化学博士学位和英国布里斯托尔大学胶体与界面科学理学硕士学位。
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses, and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
