Indium Corporation will feature its proven Indium3.2HF Solder Paste for fine-pitch printing at SiP Conference China 2019, September 10-11, in Shenzhen, China.
Indium Corporation’s Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste specifically formulated with fine-pitch powders for fine-feature printing applications. Indium3.2HF offers consistent, repeatable printing performance, combined with a long stencil life. In addition to a proven track record that includes use in more than 2 billion mobile FEM modules, Indium3.2HF delivers:
- Good response-to-pause
- A wide reflow profile window
- Outstanding slump resistance
- Excellent wetting capability
- Superior fine-pitch soldering ability
- Water-washable flux residue
From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications. For more information on Indium Corporation’s materials for SiP or Indium3.2HF Solder Paste, visit indiumstg.wpenginepowered.com/SiP
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
