Indium Corporation will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-Feb. 3, San Francisco, Calif., US.
Indium Corporation is the leading solder supplier for laser and optical applications. Au-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible.
Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product. Indium Corporation’s Au-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
- 高度精确的厚度控制
- 边缘质量精确，几乎无毛刺
- 优化清洁度控制
- 默认的华夫饼包装方法
Indium Corporation’s Au PDA preforms are available in the following alloys:
- 80Au/20Sn, 79Au/21Sn, 78Au/22Sn, 75Au/25Sn
- 88Au/12Ge
- 82Au/18In
- 96.8金/3.2硅
Indium Corporation’s AuLTRA 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA product line also comes in 78Au/22Sn and 79Au/21Sn compositions.
Indium Corporation’s AuLTRA ThInFORMS are 0.00035-thick (0.00889mm or 8.89m) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA ThInFORMS help combat common issues such as:
- Shortingreduced solder volume inhibits wicking up the die, minimizing the risk of shorting
- Poor thermal transferthe ultra-thin 0.00035 preform reduces bondline thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device.
A leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most commonly used gold-based alloy is 80Au/20Sn; it is the pillar alloy of the microelectronics industry with a melting point of 280C and works exceptionally well in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation’s AuSn solder offers numerous benefits including:
- Highest tensile strength of any solder
- High melting point compatible with subsequent reflow processes
- Superior thermal conductivity
- 抗腐蚀
To learn more about Indium Corporation’s precision Au-based preforms, visit indiumstg.wpenginepowered.com/products/solders/gold/gold-preforms or stop by booth #3085 at the show.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至Jingya Huang。您还可以关注我们的专家团队“From One Engineer To Another”（#FOETA），访问www.linkedin.com/company/indium-corporation/或关注@IndiumCorp。
关于 SPIE 西部光子展
光学和光子学界分享激光、生物医学光学和生物光子技术、量子和光电子学领域最新进展的盛会。
