Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, shared his expertise during two professional development courses at the 19th International Conference on Electronic Packaging Technology (ICEPT 2018) on Aug. 8 in Shanghai, China.
Achieving High Reliability for Lead-Free Solder Joints – Materials Consideration detailed the material considerations required for achieving high-reliability in lead-free solder joints. The goal of this course was to provide participants with the understanding of how various factors contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.
The second course, Power Electronic Packaging Reliability, Materials, Assembly and Simulation, educated participants on the lead-free materials best used to achieve high-reliability solder joints in power electronics at varying temperatures.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys and solder pastes for SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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