April 26, 2018
Indium Corporation has earned the SMT China Vision Award for its Indium10.1HF Solder Paste on April 24 at NEPCON China.
SMT China Vision 奖旨在表彰在SMT方法、工艺、材料、设备、软件和管理服务方面拥有创新产品和技术的国内外公司。每项参选产品均根据其创造性、技术先进性以及对降低成本、改善质量、提高效率、增强可靠性、确保安全和保护环境的贡献进行评估。
Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom terminated component (BTC) assemblies.
In addition to the ultra-low voiding, Indium10.1HF has a variety of characteristics that make it the best choice to address the challenges of the industry’s trend toward miniaturization, including:
- High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities
- Solder beading minimization
- Very low bridging, slump, and solder balling
- Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
- High print transfer efficiency with low variation
For more information about Indium10.1HF Solder Paste or Indium Corporation’s complete Pb-free solder paste series, visit https://www.indium.com/solder-paste-and-powders/lead-free/ or email [email protected].
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、马来西亚、新加坡、韩国、英国和美国均设有工厂。
有关 Indium Corporation 的更多信息，请访问www.indium.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家 From One Engineer ToAnother®(#FOETA) 。
