Indium Corporation Strategic Advisor Dr. Dongkai Shangguan is scheduled to deliver a keynote presentation at NordPac, hosted by IMAPS, June 12-14, in Oslo, Norway.
The presentation, titled Interconnect Reliability: From the Chip to the System, examines the importance of interconnect reliability to the overall integrity of semiconductor packaging and electronic systems. As newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical. The growing adoption of heterogeneous integration leads to increased diversity of interconnects (with different geometries, materials, and interfaces) in the same package, with complex (and often interactive) reliability failure modes and mechanisms.
"上官博士说："作为来自学术界和工业界的微电子封装专家的国际盛会，NordPac是一个讨论整个领域正在进行的突破性研究的极具价值的论坛。"我很荣幸 IMAPS 邀请我在这一重要会议上为我尊敬的同行们做主题演讲。
Dr. Shangguan is a Strategic Advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also served as a Distinguished Lecturer for IEEE EPS. He has been honored with some of the industry’s most prestigious awards, including IPC’s President’s Award, the Society of Manufacturing Engineers’ (SME) Total Excellence in Electronics Manufacturing Award, the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others. Dr. Shangguan received a bachelor’s degree in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K., and the University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published two books, more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 30 U.S. patents and several foreign patents.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至Jingya Huang。您还可以关注我们的专家团队“From One Engineer To Another”（#FOETA），访问www.linkedin.com/company/indium-corporation/或关注@IndiumCorp。
关于 IMAPS
国际微电子组装与封装协会（IMAPS）是致力于通过专业教育促进微电子和电子封装技术进步与发展的最大协会。学会的技术组合通过顶级专业活动、独家微电子封装研究图书馆、地方分会网络和其他工作进行传播。协会成立于 1967 年，当时名为 ISHM，后于 1996 年与国际电子与封装协会 (IEPS) 合并，至今已有 50 多年的网络、教育和出版历史。
