Indium Corporation’s Maria Durham, Product Specialist – Semiconductor and Advanced Assembly Materials, will present at the International Microelectronics and Packaging Society (IMAPS) International Conference and Exhibition on Device Packaging in Scottsdale, Arizona on Tuesday, March 12.
Durham’s presentation, Semiconductor Fluxes for Wafer Bumping in 3D Assembly, examines, both experimentally and with theoretical analysis, the spin-coating process for bump fusion fluxes. Spin-coating is an important processing technique used in several industries, particularly in the electronics industry, to coat silicon wafers with different materials, such as photoresist (semiconductor fabrication) and bump fusion fluxes (in semiconductor assembly).
Durham serves as a technical liaison between Indium Corporation’s customers and internal departments, such as sales, technical support, research and development, and operations to ensure the best quality and selection of products. She earned her bachelor’s degree in Physics and Applied Mathematics from Clarkson University in Potsdam, N.Y. While at Clarkson, she worked as a McNair Scholar where she performed research in electro-chemical deposition.
IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, and professional development courses. IMAPS currently has more than 8,000 national and international members. For more information or to register for the event, visit www.imaps.org/devicepackaging.
铟泰公司 是面向全球电子、半导体、太阳能、薄膜及热管理 市场的顶级材料供应商。产品包括焊料、焊片 以及助焊剂；硬钎焊 ；溅射靶材 ；铟、镓（Ga） 以及锗金属和化合物 ；以及Reactive NanoFoil®。铟泰公司 成立于1934年，拥有全球技术支持团队，并在中国、新加坡 、韩国、英国和美国设有工厂。
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