Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the Materials Science and Technology Conference October 27-31 in Montreal, Canada.
张博士在题为 "用于高温贴片应用的无铅 BiAgX™ 焊膏的可靠性和耐腐蚀性"的报告中介绍了在确定高熔点、高含铅焊料合金的无铅替代品方面所开展的研究。报告讨论了一种新型高熔点、无铅BiAgX®混合焊膏系统，并将其性能与几种高含铅焊料合金进行了比较。
Dr. Zhang is a Research Metallurgist for Indium Corporation’s research and development department. His focus is on the development of lead-free solder materials for high temperature and/or high fatigue resistance applications, and the investigation of associated technologies. He and Dr. Ning-Cheng Lee invented the mixed powder solder technique in which minor additives are used to improve the wetting and modify the bonding interface, thus increasing the bonding strength. On the basis of this technique, the BiAgX® solder system was invented as an alternative high-temperature lead-free solder.
张宏文博士拥有中南大学冶金物理化学学士学位、中国科学院金属研究所材料科学与工程硕士学位、密歇根理工大学机械工程硕士学位以及密歇根理工大学材料科学与工程博士学位。
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
