Indium Corporation’s Jordan Ross, Senior Product Manager – Engineered Solders and Thermal Materials, and Dr. Weiping Liu, Research Metallurgist, will present a workshop on Composite Solder Preforms for High Temperature Pb-free Die Attach on Wednesday, March 20, 2013 at the Semiconductor Thermal Management and Measurement Symposium (Semi-Therm) in San Jose, CA.
High temperature Pb-free solder materials are needed in die-attach, flip-chip packaging, power semiconductor, and optical device packaging. In this workshop, Ross and Liu will discuss a special laminate composite preform specifically developed for high-temperature Pb-free solder applications, where a melting temperature of 280°C or higher is required.
Ross manages Indium Corporation’s most diverse product group: solder preforms, ribbon and foil; thermal interface materials; and Heat-Springs®. He is responsible for product launches and the development and execution of regional and application strategies. Ross has led the effort to bring new products to life, including Indium Corporation’s patented Heat-Spring® thermal interface materials, metal-direct thermal interface materials, (mdTIM), and semiconductor-grade solder preforms and ribbon.
罗斯拥有纽约州立大学理工学院商业与公共管理学士学位。他曾多次在行业论坛和会议上发表演讲。
Liu 在材料连接和加工领域发表了 70 多篇研究论文,并多次在国际会议上获得 "最佳论文 "奖。2004 年,他被美国焊接学会授予 Masubuchi 奖,以表彰 "40 岁以下通过研究和开发为材料连接科技进步做出重大贡献的杰出科学家"。他被列入《马奎斯美国名人录》和《马奎斯科学名人录》。
Liu 拥有哈尔滨工业大学材料科学与工程博士学位。
Semi-Therm is an annual forum for the exchange of the latest technical developments in thermal management of electronic devices, components, and systems. The symposium is dedicated to providing an informal atmosphere, which highlights the latest advances in the field.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium metals and compounds; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
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