Indium Corporation will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-Feb. 3, San Francisco, Calif., US.
Indium Corporation is the leading solder supplier for laser and optical applications. Au-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible.
Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product. Indium Corporation’s Au-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
- 高度精确的厚度控制
- 边缘质量精确，几乎无毛刺
- 优化清洁度控制
- 默认的华夫饼包装方法
Indium Corporation’s Au PDA preforms are available in the following alloys:
- 80Au/20Sn, 79Au/21Sn, 78Au/22Sn, 75Au/25Sn
- 88Au/12Ge
- 82Au/18In
- 96.8金/3.2硅
Indium Corporation’s AuLTRA 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA product line also comes in 78Au/22Sn and 79Au/21Sn compositions.
Indium Corporation’s AuLTRA ThInFORMS are 0.00035-thick (0.00889mm or 8.89m) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA ThInFORMS help combat common issues such as:
- 短路时减少的焊料量可抑制焊料向裸片上淌，最大限度地降低短路风险
- 热传导性能差 0.00035 超薄预型件减少了键线厚度（BLT），从而改善了热传导性能，提高了设备的寿命和性能。
A leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most commonly used gold-based alloy is 80Au/20Sn; it is the pillar alloy of the microelectronics industry with a melting point of 280C and works exceptionally well in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation’s AuSn solder offers numerous benefits including:
- 在所有焊料中拉伸强度最高
- 高熔点与后续回流焊工艺兼容
- 卓越的导热性
- 抗腐蚀
To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #3085 at the show.
关于铟泰铟泰公司
铟泰公司是全球电子、半导体、薄膜和热管理市场首屈一指的材料精炼商、冶炼商、制造商和供应商。 产品涵盖焊料与助焊剂、硬焊料、热界面材料、溅射靶材、铟、镓、锗、锡等金属及无机化合物，以及NanoFoil™（ ）。公司创立于1934年，拥有全球技术支持体系，工厂遍布中国、德国、印度、马来西亚、新加坡、韩国、英国及美国。
如需了解更多铟泰公司信息，请访问www.indium.com或发送邮件至黄静雅。您还可关注我们的专家团队"工程师同行"（，#FOETA）的推特账号www.linkedin.com/company/indium-corporation/或@IndiumCorp。
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