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Indium Corporation to Showcase Technical Content at PCIM Europe E-Mobility Area and Forum

Indium Corporation will showcase material from its vast library of technical content during the E-mobility Forum at PCIM Europe 2019 from May 7-9 in Nuremberg, Germany. 

Trade visitors will be able to visit the E-mobility Area to examine specialized booths focused on electromobility, including new developments and challenges in power electronics due to the evolving electric automotive industry. Additionally, Indium Corporation will deliver a presentation at the E-mobility Forum on May 9. 

Seth Homer, Product Manager, Engineered Solders, will present The Impact of Solder Alloy Integrity in Power Electronics, which discusses the role of solder alloys on power electronics designs amid challenges for improved reliability and performance. Some of the criteria to be discussed include alloy homogeneity, purity, and the impact of dimensional tolerances.

Homer has more than 20 years of industry experience in both manufacturing operations and marketing roles. He is responsible for many of the company’s engineered solder products, especially as it relates to the power electronics industries. He travels to customer sites globally to gain industry insight and works closely with Indium Corporation’s manufacturing teams to help support current production demand and future product development.

Indium Corporation will also feature high-reliability materials for automotive power solutions on the forum’s poster wall. Specially formulated to address a variety of issues in the automotive industry, these products include the following:

  • Indium8.9HF Solder Paste offers enhanced electrical reliability and no dendritic growth.
  • InFORMS® optimizes solder volume with high-reliability solder preforms and ribbon.
  • Heat-Spring® and HSMF thermal interface materials (TIMs) provide superior thermal management in power modules.

Indium Corporation is also exhibiting at the show and will feature the high-reliability products reviewed in their experts’ presentations, as well as other high-performance thermal interface materials designed to improve first yields.For more information about other research by Indium Corporation’s experts, visit indiumstg.wpenginepowered.com/techlibrary or look for their technical engineers at the show in hall 6, stand 108.

铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂;硬钎焊 ;热界面材料;溅射靶材 ;铟、镓(Ga) 、锗和锡等金属及无机材料化合物 ;以及NanoFoil®。该公司成立于1934年,拥有全球技术支持网络,并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。

如需了解铟泰公司更多信息,请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”(#FOETA)。