Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will present two papers, A Novel Flexible Ag (Silver) Paste and Next Level Requirements for Ultra Fine Pitch Printing, at the Pan Pacific Microelectronics Symposium held on the Big Island of Hawaii, February 10-12, 2009.
A Novel Flexible Ag (Silver) Paste will explore the features and benefits of silver metallization paste, LTTF-6363, developed for thin film photovoltaic flex solar cells. Next Level Requirements for Ultra Fine Pitch Printing will review the new technology requirements and explore how they will affect the performance of solder paste and stencil technology in the manufacturing and printing processes. Both papers will be presented as part of session THA1: Materials and Deposition on Thursday, February 12th.
Indium Corporation is also sponsoring the event’s welcome reception for symposium attendees on Tuesday, February 10th.
Sponsored by the SMTA, the 14th Annual Pan Pacific Microelectronics Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems, nanotechnology, solar electronics, and assembly.
李博士是世界知名的焊接专家，也是SMTA的杰出会员。他在高温聚合物、微电子封装材料、底部填充材料和粘合剂的研发方面拥有丰富的经验。他目前的研究兴趣涵盖用于电子和应用互连及封装先进材料，重点兼顾高性能与总体成本低。
铟泰公司 面向全球电子组装、半导体制造与封装、太阳能光伏以及热管理 顶级材料供应商。该公司成立于1934年，提供以先进材料科学为核心的广泛产品、服务及技术支持。 公司在中华人民共和国、新加坡、韩国、英国和美国均设有生产基地，曾四次荣获弗若斯特沙利文奖，并通过了ISO-9001认证。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
