Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.
Dr. Lee’s presentation, Shock Resistant and Thermally Reliable Low-Ag SAC Solder Doped with Mn for Portable Medical Devices, discusses a new soldering alloy doped with Mn, and its considerable improvement in shock resistance and thermal fatigue performance.
Dr. Lasky’s presentation, Tin Whiskers: Causes, Risks, and Mitigation, reviews what tin whiskers are, how they form, mitigation techniques, and how to use failure modes and effects analysis as techniques to assess tin whisker risk.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advance materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 30 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog, which can be found at indiumstg.wpenginepowered.com/drlasky.
铟泰公司 是一家面向全球电子、半导体、太阳能、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。Indium公司成立于1934年，拥有全球技术支持团队，并在中国、新加坡 、韩国、英国和美国设有工厂。
如需了解有关铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至[email protected]。
