Products Compounds Indium Sulfamate Plating Bath

Indium Sulfamate Plating Bath

Enhance your plating process with our indium sulfamate plating bath, designed to deposit high-purity indium on a variety of substrates. Whether you’re working on prototypes or large-scale production, this premium solution delivers the performance and reliability essential for industries like microelectronics and aerospace, ensuring top-quality metal finishes every time.

技术支持:铟泰公司

  • 卓越的稳定性
  • 统一沉积
  • 高抛配方
一个贴有警告标签的 1 升透明化学瓶直立放置。旁边的黑色表面上有两条银色金属带。

Indium Corporation’s sulfamate electroplating solution is available in small bottles, 55-gallon drums, or larger totes, providing flexibility to suit any production scale. This room-temperature plating bath requires minimal additives, in large part due to its efficient anode system that continuously replenishes indium metal. With proper maintenance, the bath can last for years, requiring only occasional solution top-ups.

The plating can be applied to a range of well-prepared substrate metallizations, including copper, brass, nickel, gold, tin, and mild steel. However, stainless steel and aluminum require specialized surface treatments before electroplating with any metal.

  • Indium content: 30g/L and above, depending on specific requirements
  • pH 值范围:1.5-3.5 (首选 1.5-2.0)
  • Operating temperature: Room temperature (20-25°C)
  • 阴极效率:90
  • 阳极效率:100
  • Deposition rate: Approx. 1.5 mils/hour at 20amps/ft²

卓越先锋

绿色与清洁

最佳性能

阴极效率

Prepared as a ready-to-use solution with a standard concentration of 30g/l of indium ions with tailoring options to meet specific customer requirements.

综合电镀套件是小型电镀项目和原型制造的理想之选。套件包括

  • 1 升氨基磺酸盐电镀槽溶液
  • 两片薄铟金属带(1 英寸 x 12 英寸 x 0.0625 英寸,纯度 4N)作为阳极材料
  • 详细介绍镀铟槽的设置、操作和维护的电镀手册

产品数据表

Indium Sulfamate Plating Bath PDS 97686 R5.pdf

相关应用

Indium sulfamate plating baths are suitable for a variety of applications.

在一个设有多个电镀槽的工厂内,正在使用电镀套件处理金属框架。

电镀

尝试铟电镀以提升外观并……

正方形半导体芯片特写,绿色和黑色背景上有四个细分部分。

倒装芯片

A crucial technique in advanced semiconductor packaging.

黑色背景上均匀分布的光滑球形颗粒网格。

焊点/凸块

Achieve robust solder bumps on wafers with…

相关市场

Indium Corporation’s indium sulfamate plating baths are recommended for use in the following markets:

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