CLINTON, N.Y., May 13, 2026 — Indium Corporation® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder thermal interface materials (sTIMs) to address next-generation AI and high-performance computing thermal challenges at the IEEE Electronic Components and Technology Conference (ECTC), May 26-29, in Orlando, Florida.
The presentation, Fluxless Vacuum Formic Acid Reflow of Indium Solder Thermal Interface Materials in Large Area BGA Packages, reveals that indium sTIMs, with 86W/mK thermal conductivity, significantly outperform polymer thermal interface materials (TIMs) through enhanced metallurgical bond capability, and improved thermal cycling performance and reliability. Additionally, vacuum formic acid reflow minimizes voiding—critical for multi-reflow applications like BGA assembly. Research results demonstrate pathways to ultra-low voiding for uniform heat dissipation in demanding next-generation processors and data center applications.
Kyle Aserian is an Applications Development Engineer in the ESM department, specializing in high-performance TIMs and their successful implementation into real-world assemblies. He joined Indium Corporation in 2022 as a Research Associate Scientist, focusing on solder alloy characterization and test method development.
ECTC attendees can attend Aserian’s presentation on May 27 at 11:55 a.m. EDT. To learn more about Indium Corporation’s solder thermal interface materials, visit indium.com or meet with our experts at ECTC booth 240.
关于铟泰铟泰公司
铟泰公司®是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
