Indium Corporation will introduce Indium10.5HF, a new halogen-free, Pb-free solder paste at the IPC APEX Expo Feb. 24-26 in San Diego, Calif.
Indium10.5HF is a no-clean solder paste designed to improve ICT first-pass yields. It is specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry.
Indium10.5HF solder paste has a soft, pliable, non-tacky residue that minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields. Indium10.5HF offers unprecedented stencil print transfer efficiency, making this solder paste suitable in the broadest range of processes. It also provides excellent head-in-pillow performance. Indium10.5HF solder paste saves time and increases output for companies that require ICT as part of their normal production.
"This solder paste is ideal for customers in a wide range of markets, including automotive, medical, computing, communications, and aerospace/military," Glen Thomas, product manager, PCB solder paste said. "Additionally, many of our customers have reported improved wetting and solderability for their applications, especially for RF shield-attach."
For more information about Indium10.5HF or Indium Corporation's complete Pb-free Solder Paste series, visit us at APEX in booth #1027, online at indiumstg.wpenginepowered.com/APEX-2015, or email [email protected].
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or @IndiumCorp.
