Indium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California.
Indium Corporation’s Indium3.2HF Solder Paste meets current and evolving challenges encountered in fine-pitch Heterogeneous Integration and SiP applications. Indium3.2HF delivers:
- Consistent printing performance
- Long stencil life
- Outstanding slump resistance
- Excellent wetting ability
- Superior fine-pitch soldering ability
- Water solubility
Indium Corporation’s soldering materials for HIA and SiP applications have a proven track record of success in more than 2 billon front-end module SiP devices manufactured in the last three years using the company’s materials.
See Indium Corporation’s experts at the show or visit the company’s HIA page at indiumstg.wpenginepowered.com/HIA to learn more.
铟泰公司 是一家面向全球电子、半导体、薄膜及热管理 市场的顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊 ；热界面材料；溅射靶材 ；铟、镓（Ga） 、锗和锡等金属及无机材料化合物 ；以及NanoFoil®。该公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚 、新加坡 、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
