Indium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
At 10 a.m. local time, Indium Corporation Junior Application Engineer Siegfried Lorenz will present on a new solder paste technology for high-reliability applications. Based on novel solder paste alloy technology, this material offers special wetting behavior that supports low-voiding and enhanced thermal cycling performance (-40C/125C and -40C/150C). It also reduces solder joint cracking and increases shear strength.
“Perfectly suited for high-reliability applications, this new solder paste technology is the ideal choice for demanding applications that require longer thermal cycles,” said Lorenz. “The EPP InnovationsFORUM is an ideal platform to share this exciting data with my colleagues.”
Lorenz is responsible for providing application engineering support for Indium Corporation’s customers throughout Germany, Austria, and Switzerland. He provides customers with engineering and specifications assistance. He also helps to accelerate the sales cycle by providing technical recommendations. Prior to joining Indium Corporation, Lorenz held positions as a senior mechanic, SMD operator, and head of SMD with major semiconductor manufacturers and electronic design firms. He holds a bachelor’s degree in electrical technology and management.
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
