Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will present at ICEPT 2015, August 11-14 in Changsha, China.
Dr. Lee’s first presentation, Partially-Dried No-Clean Flux At Under-Component Terminations: Risks and Solutions, will discuss a new halogen-free no-clean SnAgCu solder paste that has been developed to address the reliability issues caused by insufficiently dried or burnt-off flux residue that can affect reliability.
Achieving High Reliability Via Pressureless Sintering of Nano-Ag Paste for Die-Attach reveals the results of developing a nano-Ag sintering paste designed for a pressureless sintering process under air. The paste was tested in different sintering temperatures and evaluated for porosity and effects of thermal aging.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
ICEPT 2015 is a four-day event featuring the latest technological developments in electronics packaging, manufacturing and packaging equipment, and emerging research and development trends. For information, visit www.icept.org.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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