2020 SPIE Photonics West Show
Come see Indium Corporation's new AuLTRA™ ThInFORMS™ at SPIE West in San Francisco, CA Feb. 4-6, 2020. AuLTRA™ ThInFORMS&tr...
Come see Indium Corporation's new AuLTRA™ ThInFORMS™ at SPIE West in San Francisco, CA Feb. 4-6, 2020. AuLTRA™ ThInFORMS&tr...
When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-e...
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. Thi...
Indium Corporation’s gold/tin solder paste gives manufacturers the versatility to produce high volumes of scaled-up product on demand without co...
We’re featuring our Au solder product line and braze materials at the High-Temperature Electronics Network (HiTEN 2019) at St. Anne’s Coll...
Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?...
Performing die-attach using AuSn solder alloy preforms against gold plating? You may need an off-eutectic solder alloy to compensate for the Au that i...
Comes see us at the International Microwave show on June 12-14. We’ll be highlighting our high-temperature product along with many other pr...
80Au20Sn solder preforms transfer heat from the active layer in laser diodes, creating a strong bond for long-term reliability. ...
Not all fluxes can handle the high processing temperature required for Au/Sn solder preforms....
Soldering without flux is generally regarded as difficult if not impossible. Yet a fluxless process is routinely done with 80Au/Sn ribbon and preforms...
Au/Sn is available in all the forms you would expect from conventional solder alloys. ...