Indium Thermal Interface Material Performance Data Perpetuates use of English Units
Should we cite thermal interface material performance data in English units or Metric? If you have......
Substrate Cleaning for Good Solderability-Solder Fluxes and Alternatives
To ensure high quality, reliable solder connections, for most devices it is a requirement to have very clean substrates. Without a clean substra...
IWLPC 2008 – WLP
Fluxes for Wafer-Level Printing At ~4pm on October 15th, I’ll be sharing the results of print tests for......
Applying TacFlux® to a Solder Thermal Interface Material
The process of applying a solder thermal interface material typically includes applying flux to a solder preform and reflowing it in......
Package-on-Package Solder Paste for a High Yield Process
From a mechanical perspective, larger solder joints are generally preferred when assembling package-on-package (PoP) components. Just as ...
Wafer Flux for a High Yield Process
Wafer fluxes seem pretty simple, just some liquid that helps form bumps on an electroplated wafer. The truth......
Ball Attach Flux for a High Yield Process
If you have been hoping that you current BGA process doesn’t fall victim to non-wets, it’s time to gain......
Solder Spheres for a High Yield Process
Surprises are rarely a good thing in production. High quality spheres minimize those ‘surprises’ when building BGAs and......
Meet The Bloggers – An Interesting Mix
As mentioned last week, we are holding another Meet The Bloggers at SMTAI on Aug. 20th. If you are......