IMAPS 2013: International Symposium on Microelectronics
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending b...
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending b...
Folks, Let’s see how Patty is recovering from her conflict with Hal Lindsay……. Patty saw a link on one of the daily SMT Tech new...
Solder seems pretty simple, and, honestly, it doesn’t always need to be overly technical. But, many SMT, semiconductor, thermal management, and ...
Panning for gold is a thrill, just like scratching off a lotto ticket or playing a game at a casino. In a similar way, I am looking for gold every tim...
I recently caught up with Brent Boek, Supervisor of the indium cell at our Utica Business Park manufacturing facility in New York. Brent and his crew ...
As I mentioned in an earlier post, some soldering applications require a fluxless process. In this line of work you see an assortment of odd soldering...
We have observed that the temperature at which two materials are bonded will set the base temperature that any subsequent CTE is measured from. T...
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...
Folks, We tend to think of mixing as something that can completely even out those things being mixed. As an example, let’s assume you are ...
A traditionally bonded sputtering target experiences a wide range of temperatures over its life cycle. It is bonded at over 200°C – usually ...
In an earlier post I mentioned one of the presentations we gave at the 2013 SVC TechCon. The other presentation that our team delivered at t...
The development of SACm® lead-free solder alloy by Indium Corporation’s R&D team was focused around improving the mechanical shock perfo...