Reflow of Copper Pillar Microbumps
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...
Wafer bumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste prin...
Folks, We tend to think of mixing as something that can completely even out those things being mixed. As an example, let’s assume you are ...
A traditionally bonded sputtering target experiences a wide range of temperatures over its life cycle. It is bonded at over 200°C – usually ...
In an earlier post I mentioned one of the presentations we gave at the 2013 SVC TechCon. The other presentation that our team delivered at t...
The development of SACm® lead-free solder alloy by Indium Corporation’s R&D team was focused around improving the mechanical shock perfo...
As an application engineer working with various NanoFoil® applications, I have learned which common items are very handy to have with me whenever...
The attachment of concentrated photovoltaic (CPV) cells is the perfect application for NanoFoil®. Due to the isolated heating during bonding, less...
When dealing with bonding, we often mention CTE (Coefficient of Thermal Expansion). This is a very important topic when designing a soldered interface...
Folks, A reader writes: Dear Dr. Ron, I need to measure the void content of an alloy. Is there an easy way to do it? After a little thoug...
As I discussed in my last post, the industry has found that reducing the silver content of SAC alloys helps to improve its mechanical shock performanc...
It is no secret that automotive semiconductor customers are becoming increasingly demanding. The “under the hood / bonnet” electronics env...
Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or co...