Thermal Management Using Indium Metal: The Heat-Spring®
High performance thermal management requires high performance materials. In this case, Heat-Spring®...
High performance thermal management requires high performance materials. In this case, Heat-Spring®...
Phil Zarrow: Seth, let’s discuss Indium Corporation’s thermal interface materials a bit. Seth Homer: Sure. Indium Corporation produces ...
Recently I heard about two of my friends (and co-workers) taking on an additional responsibility in the electronics industry. Tim Jensen (Senior Produ...
Most people think of our alloys only in the ‘soldering’ sense. However, these same materials may be used in applications where they aren&r...
Today’s technology simplifies the translation of an idea into a design. A drawing can be dimensioned in an instant. Thermal models and str...
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending b...
The attachment of concentrated photovoltaic (CPV) cells is the perfect application for NanoFoil®. Due to the isolated heating during bonding, less...
When dealing with bonding, we often mention CTE (Coefficient of Thermal Expansion). This is a very important topic when designing a soldered interface...
A NanoBond® acts like a traditional solder bond in many ways. After reaction, the bulk properties of NanoFoil® are similar to that of many sol...
NanoFoil® has many uses, and, sometimes, it has more than one function in an application. For instance, if tin coated NanoFoil® is......
March 13th is the 78th anniversary of the founding of Indium Corporation. Dr. William S. Murray, J. Robert Dyer JR, and Daniel Gray combined to ...
Folks, Patty is getting ready for her meeting on “Copy Exactly” with Mike Madigan….... It was after 6:30 PM and Patty was just arri...