Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will lead a workshop titled Materials Considerations for Achieving High-Reliability Lead-Free Soldering at the LED Assembly, Reliability & Testing Symposium in Atlanta, Georgia on Dec. 1.
As the electronics industry rapidly advances toward miniaturization, two drivers dictate manufacturer success: low-cost and high-reliability. This course examines the roles of solder composition on cost and reliability, including a review of material properties, soldering performance, known failure modes, and the primary merits of alloys.
Dr. Lee is a world-renowned soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with an emphasis on both high-performance and low cost of ownership.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理、太陽電池市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
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