Indium Corporation was presented with the Global Technology Award for Solder Paste for Indium10.1HF Solder Paste at SMTA International (SMTAI) Conference in Rosemont, Ill.
Indium10.1HF Solder Paste is a halogen-free, no-clean formula that delivers ultra-low voiding in bottom terminated components (BTCs). The flux is specifically engineered to improve reliability by minimizing voiding while also providing excellent wetting, lower solder beading, and reduced solder balling to meet IPC specifications. Indium10.1HF also minimizes slumping and resists head-in-pillow defects.
Indium10.1HF is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology. This solder paste has robust reflow capability and a wide process window, accommodating various board sizes, component sizes, and throughput requirements.
Sponsored by Global SMT & Packaging, the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for more than 10 years.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
