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CLINTON, N.Y., March 18, 2026 — Indium Corporation® Product Manager – Semiconductor Dean Payne will present copper sinter paste solutions that deliver high thermal and reliability performance,

CLINTON, N.Y., March 18, 2026 — As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products

CLINTON, N.Y., March 12, 2026 — Indium Corporation® will showcase its proven solder solutions through live demonstrations at APEX Expo 2026,  March 17-19, in

CLINTON, N.Y., March 11, 2026 — As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge

CLINTON, N.Y., March 3, 2026 — Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at APEX EXPO 2026, March

CLINTON, N.Y., February 27, 2026 — Indium Corporation® will highlight high-reliability liquid metal technology and metal thermal interface material (TIM) products at SEMI-THERM 2026, March 9-12,

With Advanced Materials Solutions at CIPS 2026 CLINTON, N.Y., February 26, 2026 — As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will

CLINTON, N.Y., February 25, 2026 — Indium Corporation® Product Manager, Engineered Solder Materials (ESM), Jim McCoy, will present techniques to minimize oxidation and improve the thermal

CLINTON, N.Y., February 19, 2026 — As one of the leading providers of high-performance thermal management solutions, Indium Corporation® will feature its lineup of metal thermal interface

CLINTON, N.Y., February 17, 2026 — Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2026, taking place March 1-4 in Mesa,

紐約州克林頓市，2026年1月21日 — 英德姆公司®將於2月3日至5日在加州安納罕舉行的MD&M West展會上，展示其高可靠性AuLTRA® MediPro金焊料解決方案。AuLTRA®

紐約州克林頓市，2026年1月15日 — 銦泰公司專家將於NEPCON Japan 2026展會發表關於焊接製程與燒結材料選用的專題演講。本屆為該會議四十週年紀念大會，

紐約州克林頓市，2026年1月14日 — Indium Corporation®將於2026年1月21日至23日舉行的NEPCON Japan 2026展會上，重點展示其高度多功能的InFORCE®系列壓力燒結膏。

CLINTON, N.Y., January 14, 2026 — Indium Corporation® will feature its formic acid soldering technologies (FAST) product series at NEPCON Japan 2026, taking place January 21-23, in Tokyo. The

CLINTON, N.Y., January 9, 2026 — Indium Corporation® will showcase its high-reliability, Au-based precision die-attach preforms for critical laser applications at SPIE Photonics West, January

CLINTON, NY, January 6, 2026 — Indium Corporation Senior Technologist Ronald Lasky, Ph.D., P.E., will be among the presenters at the SMTA Pan Pacific Strategic Electronics Symposium (Pan Pac)

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of SiPaste® C312HF, a halogen-free, cleanable solder paste formulated

Indium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse® Technology during the IEEE International Conference on

Indium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held

A technical presentation on thermal interface materials (TIMs) will be featured at an upcoming webinar organized by the International Electronics Manufacturing Initiative (INEMI) and hosted by

Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 19-20 in Silicon Valley, California. AuLTRA®