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With Advanced Materials Solutions at CIPS 2026 CLINTON, N.Y., February 26, 2026 — As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will

CLINTON, N.Y., February 25, 2026 — Indium Corporation® Product Manager, Engineered Solder Materials (ESM), Jim McCoy, will present techniques to minimize oxidation and improve the thermal

CLINTON, N.Y., February 19, 2026 — As one of the leading providers of high-performance thermal management solutions, Indium Corporation® will feature its lineup of metal thermal interface

CLINTON, N.Y., February 17, 2026 — Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2026, taking place March 1-4 in Mesa,

紐約州克林頓市，2026年1月21日 — 英德姆公司®將於2月3日至5日在加州安納罕舉行的MD&M West展會上，展示其高可靠性AuLTRA® MediPro金焊料解決方案。AuLTRA®

紐約州克林頓市，2026年1月15日 — 銦泰公司專家將於NEPCON Japan 2026展會發表關於焊接製程與燒結材料選用的專題演講。本屆為該會議四十週年紀念大會，

紐約州克林頓市，2026年1月14日 — Indium Corporation®將於2026年1月21日至23日舉行的NEPCON Japan 2026展會上，重點展示其高度多功能的InFORCE®系列壓力燒結膏。

CLINTON, N.Y., January 14, 2026 — Indium Corporation® will feature its formic acid soldering technologies (FAST) product series at NEPCON Japan 2026, taking place January 21-23, in Tokyo. The

CLINTON, N.Y., January 9, 2026 — Indium Corporation® will showcase its high-reliability, Au-based precision die-attach preforms for critical laser applications at SPIE Photonics West, January

CLINTON, NY, January 6, 2026 — Indium Corporation Senior Technologist Ronald Lasky, Ph.D., P.E., will be among the presenters at the SMTA Pan Pacific Strategic Electronics Symposium (Pan Pac)

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of SiPaste® C312HF, a halogen-free, cleanable solder paste formulated

Indium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse® Technology during the IEEE International Conference on

Indium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held

A technical presentation on thermal interface materials (TIMs) will be featured at an upcoming webinar organized by the International Electronics Manufacturing Initiative (INEMI) and hosted by

Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 19-20 in Silicon Valley, California. AuLTRA®

As one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation® experts will share their technical insight and knowledge on a variety of

As one of the leading providers of high-performance thermal materials solutions, Indium Corporation® is proud to feature its lineup of metal thermal interface materials and other high-reliability

As one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly and solder industries, Indium Corporation® is proud to feature

As industries worldwide accelerate toward electrification, automation, and smarter technologies, Indium Corporation, a global leader in advanced materials, is strengthening its leadership in

With its commitment to innovation and growth through employee development, Indium Corporation announces that Senior Product Development Specialist Kevin Brennan and Marketing Communications

Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance