As the old saying goes: Less is more, right? Well, not always.
In the case of QFN component voiding, more is less. More solder – added in the form of solder preforms – can result in less voiding compared to using solder paste alone.
Voiding under QFN components presents a significant thermal reliability challenge to the industry. While solder paste is typically used to connect integrated circuits to printed circuit boards, it may contain a substantial amount of volatile ingredients (such as the fluxing agent) that can create voids. Using Solder Fortification Preforms to increase solder volume is practical in this application because solder preforms contain no flux and thus no volatiles, meaning that the solder-to-volatiles ratio is greater and consequently resultsin lowering voiding.
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