与传统的 FR4 型印刷电路板相比，柔性电路能帮助我们更好地将电子器件安装在狭小的空间内。除了灵活性，在柔性基板上可靠地安装芯片也是一项挑战。一般来说，挠性基板上的芯片使用底部填充物来保护元件和互连，并增加工艺的可靠性。如果需要使用毛细管底部填充，则需要选择合适的助焊剂。我有两个建议：
- NC-510 用于免清洗应用，具有超低的回流焊后残留物水平。这将有助于底层填充流得更快、更彻底。
- WS3622 用于水溶性应用。 这种助焊剂易于清洗，因此易于渗透的柔性基材无需与水接触过多时间。
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