Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.
The following technical papers from Indium Corporation experts will be featured:
- Fluxes Suppressing Non-Wet Opens at BGA Assembly by Dr. Ning-Cheng Lee, Vice President of Technology
- An Investigation of the Mystery of DPAK Voiding by Kimberly Flanagan, Technical Support Engineer
- Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA? by David Sbiroli, Technical Manager, Global Accounts
Dr. Lee will also lead the professional development course entitled Achieving High-Reliability for Lead-Free Solder Joints: Materials Consideration.
Indium Corporation experts will further serve as chairs for three technical sessions:
- Low-Temperature Alloys II chaired by Miloš Lazi, Technical Support Engineer
- Solder Paste Reliability II chaired by Miloš Lazi
- Stencil Cleaning Task Group chaired by Greg Wade, Technical Support Engineer, Global Accounts
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
